"The certification of Ansys Redhawk-SC, Redhawk and Totem supports our joint customers in rapidly completing new designs with improved confidence by managing increased power integrity, reliability and thermal challenges," said Sangyun Kim, vice president at Samsung Electronics. Redhawk-SC verifies massive 4nm designs by executing signoff algorithms on its underlying Ansys® SeaScape™ infrastructure - reducing simulation time from weeks to hours, while boosting modeling fidelity. Ansys® Totem™ is correspondingly certified for transistor-level custom designs.
This certification includes power integrity EM and IR-drop, statistical EM budgeting, thermal analysis and multiphysics solutions for multi-die integration. Samsung certified Ansys Redhawk-SC and Ansys® Redhawk™ for its entire line of FinFET process nodes - including 14nm, 11nm, 10nm, 8nm, 7nm, 5nm and 4nm - and will collaborate closely with Ansys on upcoming nodes. Additionally, Samsung's design teams have deployed RedHawk-SC to optimize performance, power and reliability for their advanced process node designs. Ansys Redhawk-SC was added to the certified suite to help Samsung's customers design energy efficient and highly reliable chips for markets including 5G mobile, AIML, HPC, automotive and IoT.
Samsung's next-generation silicon processes require tools with larger capacities to accommodate huge designs and innovative capabilities - including statistical electromigration (EM) budgeting and thermal reliability analysis - to overcome complex design issues.